| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SR406 FH82Z390 | 存储IC |
INTEL/英特尔 |
BGA |
20+ |
1300 |
|||
| SR2UW I3-6006U FJ8066201931106 |
|
存储IC |
INTEL/英特尔 |
BGA |
18+ |
965 |
||
| SRLFQ I5-1235U FJ8071504826802 | IC |
INTEL/英特尔 |
BGA |
24+ |
600 |
|||
| FH82H670 SRKZY | IC |
INTEL/英特尔 |
BGA |
25+ |
650 |
|||
| WGI211AT SLJXZ | IC |
INTEL/英特尔 |
QFN64 |
20+ |
7800 |
|||
| WGI219V SLKJ4 | 存储IC |
INTEL/英特尔 |
QNF |
23+ |
8000 |
|||
| SRKZW FH82H610 | IC |
INTEL/英特尔 |
BGA |
23+ |
1950 |
|||
| SRGZS J4125 FH8068003067410 | IC |
INTEL/英特尔 |
BGA |
24+ |
495 |
|||
| SRJAU FH82HM470 | IC |
INTEL/英特尔 |
BGA |
22+ |
1300 |
|||
| RK3399 | IC |
ROCKCHIP/瑞芯微 |
BGA |
19+21+ |
300 |
|||
| SR405 FH82H370 | IC |
INTEL/英特尔 |
BGA |
19+ |
2400 |
|||
| W25Q256JVEIN | IC |
WINBOND/华邦 |
24+ |
20000 |
||||
| CG82NM10 SLGXX | IC |
INTEL/英特尔 |
BGA |
17+ |
2000 |
|||
| ALC662-VD0-GR | IC |
REALTEK/瑞昱 |
LQFP48 |
23+ |
5000 |
|||
| J1900 SR3V5 FH8065301615010 | IC |
INTEL/英特尔 |
BGA |
23+ |
3872 |
|||
| KTI226V SRKTU | IC |
INTEL/英特尔 |
QFN |
22+ |
4000 |
|||
| H9CCNNNCLGALAR-NVD | 存储IC |
SKHYNIX/海力士 |
BGA |
20+ |
850 |
|||
| SR3W0 i3-8130U FJ8067703282227 | IC |
INTEL/英特尔 |
BGA |
21+ |
100 |
|||
| K4ABG165WA-MCTD | 存储IC |
SAMSUNG/三星 |
BGA |
22+ |
1800 |
|||
| SRK05 i5-1135G7 FH8069004531301 | IC |
INTEL/英特尔 |
BGA |
24+ |
696 |
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